How to Deliver On Time at Lower Technology Nodes?

Technology Nodes


 How to Deliver On Time at Lower Technology Nodes?

Over the years we have seen a wide range of advances in semiconductor design services. The Semiconductor Industry Association (SIA) announced that the global semiconductor industry recorded sales of $ 468.8 billion in 2018 - the highest annual amount in the industry ever and a 13.7 per cent increase over sales in 2017. 


As the demand for semiconductor services continues to grow and the industry witnesses a wider range of new technological innovations we can see progress towards lower geometries (7 nm 12 nm 16 nm etc). 


The main motives behind this trend are advantages in terms of power space and other various features that are possible with lower geometries.


The multiplicity of low geometries has propelled businesses in several areas particularly in the areas of IoT cloud communications and IoT cloud for hardware platforms (ASIC FPGA boards).


Delivering a lower technological design project on time is important in today's dynamic and competitive market.


 However, there are many unknowns in lower geometry that affect the planned delivery of the project/product. Given the elements below it is possible to ensure timely delivery at lower geometry nodes.


1. Modeling cost lower technologies intersection

The chip design leader provides the strong technical leadership required and has the overall responsibility for the integrated circuit design.


For lower geometry design engineers need to define the activities from specification to silicon in sequence in the correct order to estimate the resources needed and to estimate the time required to complete the tasks. 


At the same time, they should focus on reducing the cost of the overall system while meeting specific service requirements. Here are the steps engineers can take to optimize costs:


-Use multiple patterns


-Use Appropriate Design (DFT) Design Techniques


-Leverage the creation of mask connections and process control


In different deployment methods because reducing nodes is no longer economical.


 For continuous performance improvement along with cost control, some companies are now engaged in monolithic 3D circuits rather than standard planar application as it can provide 30% power savings, 40% performance improvement and reduce cost by 5-10% without switching to a new model. cross-section.


2. Advanced data analysis for the production of smart chips

In the process of chip production, a large volume of data is created on the magnificent floor. Over the years this amount of data has continued to grow exponentially with each new technological node dimension. 


The engineers have played instrumental roles in creating and analyzing data to improve forecasting maintenance and yield improving R&D and improving production efficiency and more.


Implementing advanced analyzes in chip manufacturing can help improve the quality or performance of individual components, cutting test time to improve quality assurance output increases equipment availability and reduces operating costs.


3. Efficient supply chain management

Because new technology is often released faster than the R&D timeline, everyone in the chip manufacturing industry is facing a problem in IC supply chain management. 


The big question is: how to improve efficiency and profitability in this scenario.


The answer is faster decision making and efficient integration of the various vendor requirements of customers' distribution centres, warehouses and stores so that the goods are manufactured with end-to-end visibility of the supply chain and distributed in the right quantities at the right time to the right location to minimize total system cost.


4. Process for timely delivery

Improved customer delivery is a key part of semiconductor design services. It includes capturing invitation orders to work with orders in cloud computing optimization logistics while running and delivering the final product to the customer — while keeping up-to-date on all the information required at each stage. Full flow planning ensures that no critical deadlines for the project are missed.


To overcome delays semiconductor design companies can:


Reduce the use of custom flows and move toward place flows and a path to better physical data path capabilities.


  • Set and respond to a quick response time to customer requirements and change requests.
  • Get real-time information from specifications to silicon availability in terms of booking the flow location for semiconductor design and quantity.
  • Ensure collaborative communication between teams working on the project.
  • Focus on critical analysis - reducing the risk of functional design failures to prevent business setbacks.
  • Gained utilization expertise in several project management tools.
  • Adopt Better Technologies (TSMC GF UMC Samsung) Better Methodology (Low Power and -High-Speed ​​Performance) Better Tools (Innovus Synopsys ICC2 Primetime ICV).


How to position eInfochips to serve the market?


Whether you want to design innovative products and streamline R&D costs more quickly Improve market time Improve operational efficiency or Maximize return on investment (ROI) eInfochips (Arrow Company) is the right design partner.


eInfochips has worked with leading companies in the world to contribute over 500 product designs with more than 40 million layouts worldwide. 


eInfochips has a large database of engineers who specialize in PES services, focusing on in-depth R&D and new product development.


To deliver a product in a short time to the market, eInfochips provides ASPG FPGA and SoC design services based on standard interface protocols.


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